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Dopant atoms placed with atomic precision into tunable arrays using Scanning Tunneling Microscopy can be made to display electronic and photonic properties across a wide range of structures for 2D quantum metamaterials.  

The workshop will explore commonalities between fabrication, theoretical prediction, and alternative approaches to tunable quantum materials, including cold-atom realizations.

Theoretical efforts served by this new simulation platform include Hubbard model systems, design of 2D materials, and other exotic materials.

The workshop will be organized around:

  • all-invited talks by leading researchers
  • breakout sessions for discussions and future plan
  • published Workshop Summary Report

Goal: to develop a roadmap for practitioners and funders in this burgeoning field.

We invite interested parties as well as program managers from federal agencies to attend and lend their expertise and insights.

Please click here for the workshop flyer pdf

Organizing Committee

Chair: John N. Randall, Zyvex Labs
Joshua Ballard, Zyvex Labs, Wiley P. Kirk, UT Arlington, 3DET
James Owen, Zyvex Labs, Shashank Misra, Sandia National Labs
Richard M. Silver, NIST Ezra Bussmann, Sandia National Labs
Neil Zimmerman, NIST Clark Highstrete, Sandia National Labs


          Sponsored by

The attendance for this workshop is free of charge, but because we have limited room in the venue we are using, we are asking individuals to apply to attend, saying something about their areas of interest and expertise relevant to this workshop, and how they could contribute to the workshop during discussions and break out sessions. We would also ask applicants to say what they or their institution hope to get out of attendance at this workshop.

(* = required field)

Personal Information (NIST may contact some attenders for additional information.)

If your application is accepted, would you be interested in volunteering to help with the workshop or with the written report?

Institutional Information


We will inform you of our decision on your application by October 31, 2017 or sooner.